SUSS MicroTec Enters Wafer-Cleaning Market with GreenTec Solutions and GT200 System

SUSS MicroTec launches GreenTec Solutions, a sustainable wafer-cleaning product line, and its first system, the GT200, targeting the growing advanced packaging market.

DC Metrowire Staff
••Technology
SUSS MicroTec Enters Wafer-Cleaning Market with GreenTec Solutions and GT200 System

SUSS MicroTec SE (MDAX/TecDAX: SMHN), a leading supplier of equipment and process solutions for the semiconductor industry, has announced its entry into the wafer-level cleaning market with the launch of the GreenTec Solutions product line and the introduction of its first system, the GT200. The move expands SUSS' technology portfolio into a market that currently represents an addressable opportunity of approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and increasing semiconductor demand from AI and high-performance computing applications.

"GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy," said Burkhardt Frick, Chief Executive Officer of SUSS. "By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio. Our differentiated approach combines strong cleaning performance, significantly lower chemical consumption and the elimination of hazardous acids and organic solvents."

The GreenTec Solutions portfolio is built on a hybrid cleaning approach that integrates the proven SUSS process technologies TurbulenStrip™ and CrustBuster™ from the Photomask Solutions segment into a single platform. TurbulenStrip™ incorporates lower-impact batch soaking and single-wafer handling for efficient resist and residue removal, while CrustBuster™ utilizes patented in-situ UV technology to break down and remove organic materials directly at the wafer surface in a single-wafer process chamber. Together, these technologies enable highly efficient residue removal and process stability while helping customers reduce chemical consumption, support sustainability targets, and lower overall cost-of-ownership.

The GT200, the first platform in the GreenTec Solutions line, is specifically designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, Power Device, and CMOS applications. It combines photoresist removal, surface activation, and final cleaning in one configurable platform, helping fabs reduce tool fragmentation, simplify process flows, and improve operational efficiency. For more information about the GT200, visit https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200.

SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization services to accelerate adoption, improve process stability, and de-risk technology transfers ahead of volume production ramps. The company will also showcase the latest developments in wafer-level cleaning at SEMICON West, where attendees can join Product Deep Dives. Registration is available at https://www.suss.com/en/company/events/semicon-west.

Following SUSS' strategic approach, all platforms of the GreenTec Solutions product line are designed with a focus on a high degree of modularization and standardization, with the GT200 serving as the first member of a scalable GreenTec platform. SUSS plans to expand its portfolio toward high-volume manufacturing (HVM) with a dedicated 300 mm HVM platform in 2027, followed by a 200 mm HVM platform in 2028. This provides customers with a clear migration path from evaluation to full-scale production.

"The GreenTec Solutions product line represents our vision for the next generation of semiconductor manufacturing - where sustainability and process excellence go hand in hand," said Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. "We are building on decades of experience in demanding photomask applications and transferring this expertise now into eco-friendly wafer-level manufacturing. Due to the strong interest from our customers, we are pulling in the launch of a 300 mm HVM solution."

The launch positions SUSS in a growing market with significant long-term potential. By leveraging its proven technologies and process expertise, the company aims to address the ESG needs of the semiconductor industry while providing tangible benefits for customers. For more information, visit www.suss.com.

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